Ic package types pdf The most common types of IC packages are through-hole packages, surface-mount packages, and pin grid array packages. 19 Face-to-back with fan-out RDLs, micro bump, and TMV to the next level interconnect [11] The interconnection is from the PCB, solder balls, to the lower RDLs, Chip 1 and Chip 2, TMV, and upper RDLs and Chip 3. It can be seen that Feb 7, 2025 · Different IC package types suit various needs. Organized by pin count and package type. part number pdip-28 pdip-40 plcc-28 plcc-44 plcc-68 plcc-84 qfp-32 qfp-44 qfp-80 qfp-100; w65c02s6tpg-14 : w65c02s6tplg-14 : w65c02s6tqg-14 : w65c816s6pg-14 Package Types - Free download as PDF File (. The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC Sep 14, 2023 · Below is a snippet of common electronic component package types which may help identify the package type when replacing a component or when selecting a package type for new design. See full list on electronicsforu. Package versus Packaging Let's start by clarifying the difference between the words "package(s)" and "packaging. 27) This indicatesa a plastic SOJ type package consisting of 20 leads (up to 26 leads) with package body width of 7. The most common IC package types include. com/services/package. θJA) or moving William J. θJA) or moving May 29, 2023 · Integrated circuit packaging involves placing one or more integrated circuit chips within specific packaging materials to provide protection, mechanical support, and electrical connections. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The package types included are multilayer molded (MM-PQFP), ceramic Standard packing quantities vary by package size. It provides specifications for the board material, pins, and operating temperature range. Aug 26, 2016 · With the continuous improvement of IC packaging, there are more and more types of IC packaging. 5D Jun 30, 2021 · To facilitate the management, IC chips were defined as various standard packages. Aug 1, 2023 · Common Integrated Circuit Package Types. Nov 28, 2023 · It may cause IC product function cannot be realized, higher cost, even the failure of IC design if unsuitable package type is selected. Some packages are great for small, compact devices. 15-1. Through hole packages use leads mounted into holes on the PCB, while SMT packages are mounted directly onto the PCB. Common packaging types include of semiconductor Integrated Circuits (IC) packages for different kinds of applications, ranging from automotive, consumer electronics, industrial, Internet of Things (IoT), Artificial Intelligence (AI), and many more. The most common IC package types include-Dual In-Line Package (DIP) Small Outline Package (SOP) Thin Small Outline Package (TSOP) Quad Flat Package (QFP) Quad Flat Package-Extended (QFP-EP) Quad Flat No-leads (QFN) Ball Grid Oct 29, 2024 · IC Package Types Fundamentals. Others are designed to handle high heat or provide many connections. Jun 7, 2023 · SMD IC Package Types. May 20, 2008 · Download full-text PDF Read full-text. In a single-layer technology, the IC chip is first mechanically bonded to a lead frame, and then 2 THE ADVANCED SUBSTRATEACTIVITY Standalone activity focused on the analysis of PCBs, IC substrates and RDLs • From 2017, Yole Développement is starting a separate and standalone “AdvancedSubstrate” activity, dedicated to exploring the 直插式封装通过印刷电路板上鑽孔來安裝組件。 該組件的引線焊接到pcb的焊盤上，以電氣和機械方式連接到pcb。 三个14引脚（dip14）塑料双列直插式封装，内含ic芯片。 The CerDIP is a hermetically sealed package that keeps out moisture and contaminants once it is sealed. Types of IC Packages. Figure 1 is a cross-section of a TSSOP and the main building blocks in this type of package design. 90 6. 27 (SOJ26/20-P-300-1. IC packages are classified as indicated below according to shape, material, and mounting methods. Over thirty package types are outlined, classified by board mounting method, construction form, and power handling capability. 90 3. IC Packages The package is what encapsulates the integrated circuit die and splays it out into a device we can more easily connect to. Table 2 lists SLL packages and their standard quantities. 62 × 17. From mobile telecommunication and satellite broadcasting to aerospace and automotive applications each imposes its own demands on electronic package. This blog will give you a brief introduction to IC packaging related content, which mainly includes the following three parts: common IC brand identification, IC . It then describes the front-end wafer fabrication process and back-end assembly process. Overview • Integrated Circuit (IC)- a collection of electronic devices such as transistors, diodes, and resistors that are fabricated and electronically interconnected onto a small flat chip (die) of semiconductor material, resulting in ‘Solid State Electronics. It describes common IC package types including through-hole packages like DIP and TO, as well as surface mount packages like SOT, SOIC, QFN, BGA, and LGA. range of IC product segments. Read full-text. In the first, a single-layer type, the package is constructed around the IC chip on a lead frame. Standard DIP packages are most widely used. Packaging techniques surround and protect the IC chip while providing interconnection, physical support, environmental protection, and heat dissipation. It describes the basic elements in IC and package scaling during the past development, and how they integrate. The document describes Aries Low Cost, Quick Turn prototyping adapters which mate small package integrated circuits to breadboards and breakout boards. Components may list a specific “Supplier Device Package” name provided by the manufacturer, which falls under DigiKeys “Package / Case”. carsem. Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of Dec 24, 2016 · This document discusses package design considerations and types of semiconductor packages. Assembly of semiconductor die onto a substrate is essentially the same as those used for standard I/C packaging in lead frames; however, substrate based IC packaging for 3D applications can adopt a wider range of materials and there are May 3, 2024 · The different types of IC packaging include surface mount packages (such as SOP, SOT, LGA), through-hole packages (such as DIP), advanced packages (including flip-chip, wafer-level, and 3D packaging), and specialized packages tailored for specific applications (e. Plastic packages are cheaper to manufacture, but ceramic packages have superior heat dissipation and environmental protection (from moisture creeping into the package). txt) or view presentation slides online. In early dual in-line packages (DIPs), a Ni/Fe alloy (A42) was the material of choice for lead frames as it provided a good combination of strength and formability as well as assembly process compatibility. You have read previously that every package is built for a particular function. This document provides an overview of integrated circuit packages. Dual In-Line Package (DIP) Small Outline Package (SOP) Thin Small Outline Package (TSOP) Quad Flat Package (QFP) Quad Flat Package-Extended (QFP-EP) Quad Flat No-leads (QFN) Ball Grid Array (BGA) Micro Ball Grid Array (µBGA) Ceramic Ball Grid Array (CBGA) Plastic Ball Grid Array (PBGA) Jun 21, 2018 · The article provides a review of the state-of-art non-destructive testing methods used for evaluation of integrated circuit (IC) packaging identifying various types of the defects and the capabilities of most common NDT methods employed for defect detection. monolithic IC production process is explained here – Monolithic Integrated Circuit. It has two parallel rows of pins with rectangular housing. Yields in IC Processing 2 1. 4. 5/3D IC Packaging Technologies Part 1 - Overview IEEE/CPMT, April 9, 2014 Mobile Memory Type 5 0 eda2asic …2. 15 0. Jan 15, 2024 · SO / SOIC （ 英语 ： Small outline integrated circuit ） SOP / SSOP （ 英语 ： Small outline integrated circuit ） TSOP / HTSOP （ 英语 ： Thin small outline package ） TSSOP / HTSSOP （ 英语 ： Thin shrink small outline package ） ZIP （ 英语 ： Zig-zag in-line package ） factors in IC package thermal resistance. Common package materials include ceramic and plastic. The lead pitch is 2. Notable recent additions to the package range include ball grid array packages with Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. component types. This document discusses IC packaging technology. Let’s read on. Packaging entails encapsulating bare chips within a casing to ensure their stability and reliability in practical applications. 3. Keep Heterogeneous IC Packaging, Optimizing Performance and Cost - Amkor Technology Author: sales@amkor. The type of package chosen for an IC depends on the application and the requirements of the circuit. SLL Packages and Standard Quantities PACKAGE TYPE PACKAGE PINS QUANTITY PER TRAY MATRIX CONTAINER STANDARD QUANTITY PM 64 160 8 × 20 800 TQFP PN 80 119 7 × 17 495 PCA 100 90 6 × 15 450 PZ 100 90 6 × 15 450 QFP RC 52 96 6 × IC Package Types_ A Comprehensive Guide - Free download as PDF File (. A laboratory comparison of a device type packaged in Thin Shrink Small Outline Package (TSSOP) and Ball Grid Array package (BGA) will be used to illustrate signal performance differences. The numbers are different because of the differences in package types. This will introduce you to the most common types of integrated circuit packaging: DIP, SOIC, and more. There are two main types of IC packages: through hole and surface mount technology (SMT). Recently, the market for 3D semiconductor packages such as Package on Package (PoP), capable of stacking different IC packages such as memory and logic, is growing. IC packages are the protective covers in the electronic assembly that contain the elements and interconnect them in your printed circuit board design. Below, you are going to read the most common types of packages in easy language. Aug 8, 2023 · What’s more, we list key considerations when choosing the IC package type. The base has a cavity where the microchip is mounted. Each outer connection on the die is connected via a tiny piece of gold wire to a . 5D and 3D-IC Technology 4/21/2014 14. Various IC packaging packages types, names, logos, etc. 6-3. An overview of this range is Nov 28, 2023 · The packaging specifications are divided into general and detailed specifications according to the military standard level, including semiconductor IC packages (ceramic cases such as Ceramic Leaded Chip Carrier (CLCC), Small Outline Package (CSOP), Ceramic Pin Grid Array (CPGA), CDIP, CFP, Ceramic Quad Flat Package (CQFP), Ceramic Small Out-line J-leaded Package (CSOJ), Ceramic Ball Grid Array The IC package, or Integrated Circuit package, refers to the protective enclosure that houses the semiconductor die and associated components, forming a complete and functional unit. ’ • Materials in IC: Oct 23, 2024 · Types of IC packages. IC Packaging 6. Jan 15, 2024 · 直插式封裝通過印刷電路板上鑽孔來安裝組件。 該組件的引線焊接到pcb的焊盤上，以電氣和機械方式連接到pcb。 三個14引腳（dip14）塑料雙列直插式封裝，內含ic晶片。 1 - IC Packaging Introduction IC Packaging definition, hierarchy of packaging, function of the package, package disciplines (electrical, mechanical, materials), package types (PGA, BGA and QFP), advanced packaging technologies (chip scale packaging, 3D high density packaging, PoP, System in package), package efficiency, Rent’s Rule. SSOP-PACKAGE (SHRINK SMALL OUTLINE PACKAGE) Package D E H A A1 e b L w R TH Type SSOP 16 typ. There are different types of IC packages, such as SOIC packages and dip packages. As devices become more complex, package interconnects must also evolve. Table 5-1. " The word "package" is used in this book to refer to the component's physical shape or outline. 1 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which Apr 24, 2015 · It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The document explains that IC packages serve to protect, support, connect and Apr 11, 2024 · Integrated circuit (IC) package types play a crucial role in electronics, offering protection and electrical connections for semiconductor devices such as transistors, capacitors, and other integrated circuit types. IC packing indicates the dimension and shape of a chip. The chapter reviews much integration and design styles, including System‐on‐Chip and multicore trends in IC designs; system‐in&# Multiple die packaging commonly utilizes some form of substrate interposer as a base. 4) P-TFLGA48-0707-0. 9 8 7 6 5 4 3 2 1 springer. The package types included are multilayer molded (MM-PQFP), ceramic 1) IC packages deliver power to chips, transfer signals in and out, dissipate heat, and protect chips. Monolithic IC’s have low power rating. 1/25/2006 P-DIP QFP TQFP Intel packaging technology, from information on IC assembly, performance characteristics, and physical constants, to detailed discussions of surface mount technology and Intel shipping and packing. g. It covers key factors in package design like the number of terminals, electrical, thermal, and reliability requirements. 72 4° 130° K/W Table 2: SSOP package dimensions (mm) Figure 3: SSOP-package Figure 4: Pinout SSOP16 (Top View) result, the best IC package contains the chip and does not draw atten-tion to itself. job of connecting to the IC easier, we package the die. She is a contributing editor and writer for Chip Scale Review magazine, Global SMT & Packaging News, and contributes to the IEEE/CPMT newsletter and other media. It shields the delicate IC components from external elements and mechanical stress while providing electrical connectivity and thermal management. Mar 3, 2025 · The IC package, or Integrated Circuit package, refers to the protective enclosure that houses the semiconductor die and associated components, forming a complete and functional unit. One particular semiconductor IC package is the Quad-Flat No-leads Multi- 1. As an example: Tape and Reel is Surface Mount & Through-hole Packages - Mouser Electronics In packages with a pin pitch of 1. or . Some key package types mentioned include open cavity plastic packages, dual inline packages, ball grid arrays, small outline 5. The die PACKAGING TECHNOLOGY SEGMENTATION BY SUBSTRATE TYPE ARCHITECTURE WIRE BOND FLIPPED CHIP EMBEDDED DIE 2. Monolithic IC – Can Type Being as it is, monolithic IC’s have some limitations as well. The following paragraphs define each packing configuration. Jan 5, 2024 · There are many types of IC packages, each having unique dimensions, mounting styles, and pin counts. The word "packaging" is used in this book to describe how the component is stored. packages, as well as provide custom packaging solutions for higher volume production of your opto-electronic components and devices. An integrated circuit (IC) is an electronic circuit consisting of transistors and other components on a single semiconductor substrate. DIP ICs may be through-hole [PDIP or CERDIP] or SMT package [SOJ or SOIC]. 3) Emerging trends include 3D packaging using 7. There are several different types of IC packages, each of which has its own advantages and disadvantages. Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate with a floorplan geometry suitable for connecting to a PCB. The temperature sensing component of the test chip is calibrated. pad. pin. Integrated Circuits (ICs) come in a plethora of SMD package types. To achieve this, the IC package should be compact, the wiring on the package should be very dense, and the extra interconnec-tions should not disrupt high-speed signal transmission. Choosing the right IC package starts with understanding the options. Dual In-line Packages [DIP], or Dual In-Line [DIL] packages are packages with two rows of leads on two sides of the package. This is Texas Instruments centered, but the information translates well between manufacturers. Understanding these types is key to making the best choice for your project. Chips with the same electronic parameters may have different package types. 80 This indicates a plastic LGA type package consisting of 48 Jun 27, 2023 · The world of integrated circuit (IC) packaging technology has witnessed significant advancements in recent years, and one of the most groundbreaking developments is the emergence of 3D IC and 2. copy Page 2 Tuesday, May 23, 2000 1:01 PM IC package range encompasses over 30 different types, most of which are subdivided into a number of outline versions. Today, the QFN is one of, if not the, most widely used IC package types. Winkler has earned an MBA from Santa Clara The document discusses various types of integrated circuit (IC) packages. Chapter 1 Introduction: An overview of package families, including package attributes, package types, and a package selection guide. can sometimes be confusing. Advantages of ICs over discrete circuits: Small size Low cost High reliability Packaging Types - Component Sizes - Smd Size , Capacitorsize , Capacitor Size , Capacitor Dimesion Code , Ic Package Size Chip Size 0102, 01005 , 1005, 0201 , - Free download as PDF File (. 27mm, those with a JEITA standard are SOP (Small Outline Package) and those with a JEDEC standard are SOIC (Small Outline Integrated Circuit). 75 0. 72 4° 140° K/W SSOP 20 typ. Here are some widely used integrate circuit packaging in the following: Dual In-line Package (DIP) A traditional and widely used package, the Dual In-line Package (DIP) features two parallel rows of pins. The package is designed to provide a physical and electrical connection between the chip and the printed circuit board (PCB). This document lists and defines common integrated circuit package types including Dual Inline Package (DIP), Lead Frame Chip Scale Package (LFCSP), Mini Small Outline Package (MSOP), Small Outline Integrated Circuit (SOIC), Small Outline Transistor (SOT), Shrink Small-Outline Package (SSOP), Thin Dual The document provides an overview of integrated circuit (IC) package types, classifications, structures, materials, functions and manufacturing processes. 5D 3D EMERGING Traditional Packaging Advanced Packaging Advanced Packaging Advanced Packaging Advanced Packaging Advanced Packaging PE IC Substrate (Organic) FC BGA Embedded Si Bridge Si Interposers 3DS TSV Hybrid Bonding - SoC on interposer Aug 30, 2024 · IC package is an essential component that houses and protects microchips. There are various package types including surface mount packages, chip-scale packages, bare die, through-hole packages, and module assemblies. php Summary of the most common packaging for Integrated Circuits (ICs). 19 shows a 3D IC package by SPIL [11]. package – where a chiplet is defined as an ASIC die specifically designed and optimized for operation within a package in conjunction with other chiplets. The package- and test-board system is placed in either a still air (R. IC Packages . com IC Package Types The package that the IC uses is either a through-hole package or a surface mount package, made of either plastic or ceramic. Electronic packaging provides the in-terconnection from the IC to the printed circuit board (PCB). 8. IC package is used in a wide range of electronic devices, from smartphones and laptops to cars and medical equipment. Jun 17, 2024 · Types of Integrated Circuit Packaging types of integrated circuit packaging. Greig Consultant 10 Imperial Drive Somerville, NJ 08876 Integrated Circuit Packaging, Assembly and Interconnections Library of Congress Control Number: 2006927423 the topic, most notably, The Worldwide IC Packaging Market, Advanced IC Packaging Markets and Trends, and IC Packaging Materials. Common package types include lead frame, BGA, CSP, and SiP. The package types included are multilayer molded (MM-PQFP), ceramic Packaging solutions enable to reduce size and space requirements as a key technology. com DEDICATION To my family, my wife Joan and our children, their spouses and IC Packages - Free download as PDF File (. 54 mm (100 mil), and the spacing between terminal rows is 300, 400, or 600 mil. Here are the most common IC package types: Dual In-line Package (DIP): DIP is one of the oldest and most popular through-hole package types. It describes the different types of packages including through-hole mount, surface mount, and contactless packages. TI ships product in three basic configurations: stick magazine, tray, and tape and reel. Miniaturization forced the use of new approaches in die packaging in order to achieve the Jan 25, 2022 · This will introduce you to the most common types of integrated circuit packaging: DIP, SOIC, and more. Materials which have supported the development of such semiconductor packages include printed wiring board materials and semiconductor packaging materials. The wafer fabrication process involves building circuit layers on a silicon wafer through steps An IC package falls into two basic categories. Each outer connection on the die is connected via a tiny piece of how package design effects IC signals. To meet such diverse range of requirements, IC package range encompasses over 30 different types. 26 0. 7. Apr 3, 2024 · IC Package Types. 2) Die can be attached via wire bonding, tape automated bonding (TAB), flip-chip bonding, or direct connection. electrical performance. The package is what encapsulates the integrated circuit die and splays it out into a device we can more easily connect to. Figure 7. Jan 24, 2013 · TI has a nice pdf chart for their ic packages, at actual size. 2. Another function is to provide the desired mechanical and 1. Ms. 27 mm. Flip-chip offers advantages like shorter interconnects and higher density. Stick magazine − The stick magazine (also called shipping tube) was developed in the early days of the integrated circuit (IC) industry. IC26_CHAPTER_1_2000_2. Performance Characteristics of IC Packages 4-2 2000 Packaging Databook sake of completeness, package parasitics data for older package technologies are included in the final part of this section. The document discusses several common integrated circuit (IC) package types including: - Dual In-line Package (DIP) - Popular first generation thru-hole package with leads on two sides. 7 Integrated Circuit (IC): IC is a miniature and low-costelectronic circuit consisting of active devices (Diodes, Transistors and Op-Amps), passive components (Resistors and Capacitors), joined together on a single crystal silicon chip. The base is covered by the cap and then sealed with molten seal glass. com Subject: Heterogeneous IC Packaging, Optimizing Performance and Cost - Amkor Technology Keywords: Heterogeneous IC Packaging, Optimizing Performance and Cost - Amkor Technology Created Date: 6/11/2023 5:14:49 PM Apr 9, 2014 · 2. or cavity DIP packages, the maximum allowable junction temperature is 175°C. The IC package turns the delicate, tiny die, into the black chip we're all familiar with. The package should provide a stable power supply level and should not cause the The use in this publication of trade names, trademarks, service marks and similar terms, even if the are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. txt) or read online for free. A key package Performance Characteristics of IC Packages 4-2 2000 Packaging Databook sake of completeness, package parasitics data for older package technologies are included in the final part of this section. Our characterization packages are convenient for when your PIC is still in the testing phase. Table 1 provides a comparison of different semiconductor packaging methods having a common 10 mm x 10 mm die element with 100 active contact features. The packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array) have supported high-density wiring technology and widely used in the market. A series of experiments are conducted to prove the effect of the package type on this IC failure mode. 62 mm, package body length of 17. Thus, dissipation property, reliability, and design freedom vary depending on which package type of the circuit is used. Download full-text PDF. For package type selection, full consideration should be taken for assembly method, package body size, total package pin counts, product reliability requirement, heat dissipation performance, cost etc. In this article, we will introduce its benefits, types, functions, etc. These package types provide the optical and electrical interfaces with which you can power and read out Summary <p>This chapter introduces the essentials for integrated circuits (ICs) and package designs for modern electronics products. They cannot be used for low power applications as they cannot have a power rating of more than 1 watt. DIP (Double In-line package) IC Package Types The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements. Among them, the Small Outline Integrated Circuit (SOIC) is commonplace, typically hosting 8 to 24 pins and used for low-to-moderate complexity ICs. IC packages provide physical and chemical protection for the integrated circuits inside and allow for electrical connections to the circuits. 1. Step 1 Dual In-line package (DIP) Most common for plugging into breadboards or DIP sockets Types: Plastic —PGA in plastic packaging Ceramic —PGA in ceramic packaging Flip-chip —Die facing downwards on top of the substrate Staggered —Pin layout staggered for tight compression Organic —Die attached to an organic plate Usually used for computer chips Intel’s Pentium III microprocessor Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. In the second, a multilayer type, the IC chip is assembled into a prefabricated package. A device, usually an integrated circuit (IC) package containing a thermal test chip that can both dissipate power and measure the maximum chip temperature, is mounted on a test board. 00 1. What Is an IC Package? IC package, with the full name of integrated circuit package, is an enclosure that encapsulates and shields an integrated circuit from unfavorable environmental factors such as moisture, corrosion, and dust. Increased device complexity will generate an explosion of new creative and disruptive technology packaging solutions, and in some markets and applications, packaging technology will become a key differentiator when making purchasing decisions. When comparing the WLBGA and DSBGA semiconductor packaging to the QFP lead-frame package, the surface area differences are quite dramatic. IC Package Types. Integrated Circuit (IC) packages have evolved significantly from the first IC invented in 1958 with one transistor to today's chips containing millions of transistors. Note that the pin pitch is the same, but the package body width is different. The main package types discussed are through-hole packages like DIP and QFP, and surface mount packages like SOP, PLCC, and LCCC. There are many different types of IC packages, each of which has unique dimensions, mounting-types, and/or pin-counts. This paper will examine the performance differences between the same IC type in different packages. Overview of Common IC Package Types. 15 mm and a lead pitch of 1. Table 2. It is May 29, 2023 · Integrated circuit packaging involves placing one or more integrated circuit chips within specific packaging materials to provide protection, mechanical support, and electrical connections. However, with the continued miniaturization of IC packages and the need for 2000 Packaging Databook 5-1 Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. As you can see, the integrated circuit (IC) is mounted on a lead frame (mainly using some type of epoxy) with pins protruding through the plastic housing, enabling a connection of the IC to the printed circuit board (PCB). There are various IC package types, each with specific characteristics and advantages. There are three main types of ICs: film, monolithic, and hybrid. on the package. The power IC packages offers a high thermal dissipation, enabling power IC usage in some of the most demanding application areas which integrate analog, logic, and power MOSFETs [1, 2]. The following list identifies the Package Types SiP –System in Package •Increasingly popular for high-volume small form factor products •Can combine wire bonds with flip chip •Nice solution for an application system with different types of chips and “passives” (R, L, C) http://www. Case Material Characteristics Properties Units Alumina (92%) Kovar Molding Compound Sealing Glass Cu-W (90%) Cu Density kg/m3 (g/cc) 3600-3700 (3. IC packages types are mainly divided into traditional DIP dual-in-line and SMD chip package. It begins by explaining that an integrated circuit consists of a silicon chip and a package that protects the chip and provides a way to handle the component. The difference is suppliers can call their package types whatever they Mar 27, 2012 · Package Overview Development of IC package is a Dynamic technology. IC Insights forecasts that the continuous high growth in demand for QFN-type packages will help push the flatpack/chip carrier (FP/CC) category of packages past the “old” small outline (SO) group of packages for 2000 Packaging Databook 4-1 Performance Characteristics of IC Packages 4 4. 2 3D IC Packaging 355 Metal composition type of μbump Fig. Another function is to provide the desired mechanical and A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is presented in the tables on pages 1 - 6 to 1 - 8. pdf), Text File (. The CerDIP package is composed of an upper part called the cap, and a lower part called the base. 635 0. 1 The Evolution of the Power IC Technology Types of IC Packages - Free download as PDF File (. With technology advancing rapidly, many IC package types have emerged, each presenting distinct characteristics and advantages. The thermal strain associated with the die package interface in a cavity package is much less than that exhibited in a molded package where the integrated circuit chip PACKAGE CLASSIFICATIONS 3) P-SOJ26/20-7. Pins are the silver, extruding terminals on an IC, which go on to connect to other parts of a diversity of new IC package types to meet specific applications or markets. DIP (Dual In-line Package) DIP is a classic example of an IC package. 65 3. , automotive, aerospace). (Package)IC Package Types - Free download as PDF File (. owpdaeidacafscjbtwlwmztgwqotfklcbzyifggsqtrxghcdodgyitqdwsgobwmvarzl